TY  - GEN
AU  - Sasaki,Luis H
AU  - Lobo,Paulo D C
AU  - Moriyama,Yumi
AU  - Watanabe,Ii-Sei
AU  - Villaverde,Antonio B
AU  - Tanaka,Celso Shin-Ite
AU  - Moriyama,Eduardo H
AU  - Brugnera,Aldo
TI  - Tensile bond strength and SEM analysis of enamel etched with Er:YAG laser and phosphoric acid: a comparative study in vitro
SN  - 1806-4760
PY  - 2009///0303
KW  - Acid Etching, Dental
KW  - methods
KW  - Bisphenol A-Glycidyl Methacrylate
KW  - chemistry
KW  - Composite Resins
KW  - Dental Bonding
KW  - Dental Enamel
KW  - radiation effects
KW  - Dental Etching
KW  - Dental Materials
KW  - Dentin-Bonding Agents
KW  - Humans
KW  - Lasers, Solid-State
KW  - therapeutic use
KW  - Materials Testing
KW  - Microscopy, Electron, Scanning
KW  - Phosphoric Acids
KW  - Stress, Mechanical
KW  - Temperature
KW  - Tensile Strength
KW  - Time Factors
KW  - Water
N1  - Publication Type: Comparative Study; Journal Article; Randomized Controlled Trial
UR  - https://doi.org/10.1590/s0103-64402008000100010
ER  -