Liu, R <br/><br/>
Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers.  [electronic resource] 

 -  IEEE transactions on ultrasonics, ferroelectrics, and frequency control  Jan 2001 
 - 299-306 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>0885-3010 
<br/><br/><label>Standard No.: </label>10.1109/58.896143  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Ceramics<br/>Epoxy Resins<br/>Transducers<br/>Ultrasonography--instrumentation