Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs. [electronic resource]

By: Contributor(s): Producer: 20180723Description: 8663-8670 p. digitalISSN:
  • 1520-5827
Online resources: In: Langmuir : the ACS journal of surfaces and colloids vol. 33
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Publication Type: Journal Article; Research Support, U.S. Gov't, Non-P.H.S.

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