Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology. [electronic resource]

By: Contributor(s): Producer: 20150612Description: 9515-24 p. digitalISSN:
  • 1533-4899
Online resources: In: Journal of nanoscience and nanotechnology vol. 14
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Publication Type: Journal Article; Research Support, Non-U.S. Gov't

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