High process yield rates of thermoplastic nanofluidic devices using a hybrid thermal assembly technique. [electronic resource]

By: Contributor(s): Producer: 20160418Description: 1038-49 p. digitalISSN:
  • 1473-0189
Subject(s): Online resources: In: Lab on a chip vol. 15
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Publication Type: Journal Article; Research Support, N.I.H., Extramural; Research Support, U.S. Gov't, Non-P.H.S.

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