Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate. [electronic resource]

By: Contributor(s): Producer: 20150519Description: 7117 p. digitalISSN:
  • 2045-2322
Online resources: In: Scientific reports vol. 4
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Publication Type: Journal Article; Research Support, Non-U.S. Gov't

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