Dual bonding between H2O/H2S and AgCl/CuCl: Cu/Ag bond, sister bond to Au bond. [electronic resource]

By: Contributor(s): Producer: 20140512Description: 10944-50 p. digitalISSN:
  • 1520-5215
Subject(s): Online resources: In: The journal of physical chemistry. A vol. 117
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Publication Type: Journal Article; Research Support, Non-U.S. Gov't

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