Formation of copper based nanoparticles embedded in a relatively thick polyimide film by thermal curing in reducing atmosphere. [electronic resource]

By: Contributor(s): Producer: 20090305Description: 5433-8 p. digitalISSN:
  • 1533-4880
Online resources: In: Journal of nanoscience and nanotechnology vol. 8
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
No physical items for this record

Publication Type: Journal Article

There are no comments on this title.

to post a comment.