Properties of Cu(thd)2 as a precursor to prepare Cu/SiO2 catalyst using the atomic layer epitaxy technique. (Record no. 16734106)

MARC details
000 -LEADER
fixed length control field 00852 a2200229 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250515051451.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 200702s 0 0 eng d
022 ## - INTERNATIONAL STANDARD SERIAL NUMBER
International Standard Serial Number 0002-7863
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1021/ja063083d
Source of number or code doi
040 ## - CATALOGING SOURCE
Original cataloging agency NLM
Language of cataloging eng
Transcribing agency NLM
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Chen, Ching S
264 #0 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Date of production, publication, distribution, manufacture, or copyright notice 20070220
245 00 - TITLE STATEMENT
Title Properties of Cu(thd)2 as a precursor to prepare Cu/SiO2 catalyst using the atomic layer epitaxy technique.
Medium [electronic resource]
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. Journal of the American Chemical Society
Date of publication, distribution, etc. Dec 2006
300 ## - PHYSICAL DESCRIPTION
Extent 15950-1 p.
Other physical details digital
500 ## - GENERAL NOTE
General note Publication Type: Journal Article
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Lin, Jarrn H
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name You, Jainn H
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Chen, Chi R
773 0# - HOST ITEM ENTRY
Title Journal of the American Chemical Society
Related parts vol. 128
-- no. 50
-- p. 15950-1
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://doi.org/10.1021/ja063083d">https://doi.org/10.1021/ja063083d</a>
Public note Available from publisher's website

No items available.