Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
Zhao, Di
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. [electronic resource] - Materials (Basel, Switzerland) Feb 2020
Publication Type: Journal Article
1996-1944
10.3390/ma13040831 doi
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. [electronic resource] - Materials (Basel, Switzerland) Feb 2020
Publication Type: Journal Article
1996-1944
10.3390/ma13040831 doi