A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.
Chang, Yuan-Wei
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps. [electronic resource] - Scientific reports Apr 2018 - 5935 p. digital
Publication Type: Journal Article
2045-2322
10.1038/s41598-018-23809-1 doi
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps. [electronic resource] - Scientific reports Apr 2018 - 5935 p. digital
Publication Type: Journal Article
2045-2322
10.1038/s41598-018-23809-1 doi