Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers.

Liu, R

Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers. [electronic resource] - IEEE transactions on ultrasonics, ferroelectrics, and frequency control Jan 2001 - 299-306 p. digital

Publication Type: Journal Article; Research Support, Non-U.S. Gov't

0885-3010

10.1109/58.896143 doi


Ceramics
Epoxy Resins
Transducers
Ultrasonography--instrumentation