Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor.

Name: Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor.
Author: Li, Haiwang

Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor. — المؤلف: Li, Haiwang — Micromachines Oct 2018