Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data. [electronic resource]

By: Contributor(s): Producer: 20150420Description: 807693 p. digitalISSN:
  • 1537-744X
Subject(s): Online resources: In: TheScientificWorldJournal vol. 2014
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Publication Type: Journal Article; Research Support, Non-U.S. Gov't

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